June 22, 2024
Radio Frequency Transmitter Encapsulant Market

Increasing Demand from Wireless Infrastructure Sector to Fuel Growth of Radio Frequency Transmitter Encapsulant Market

The global Radio Frequency Transmitter Encapsulant Market is estimated to be valued at US$ 2.53 Bn in 2023 and is expected to exhibit a CAGR of 5.5% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.

Market Overview:

Radio frequency transmitter encapsulant is a type of protective coating that is used to seal electronic components installed on mobile devices, wireless infrastructure equipment and other devices that transmit radio frequency signals. It protects electronic components from water, moisture, dust, chemicals and corrosion. As the name suggests, radio frequency transmitter encapsulant plays a vital role in sealing radio frequency chips and other electronic components used in transmitters. This helps in reliable functioning of radio frequency transmitters under harsh environmental conditions. The rising demand for high speed internet access and proliferation of internet-connected devices have fueled the growth of wireless infrastructure worldwide. This in turn is creating significant demand for radio frequency transmitter encapsulants from infrastructure equipment manufacturers.

Market key trends:

One of the key trends in the radio frequency transmitter encapsulant market is the growing preference for parylene coating. Parylene coating offers excellent protection against moisture, chemicals, corrosion and particulates. It forms highly conformal thin film barriers without edge peeling, unlike conventional film coatings. Parylene coating is FDA approved, biocompatible and is increasingly being used to encapsulate medical devices operating at radio frequencies. Another important trend is increasing focus on developing encapsulants that allow high radio frequency signal transmission while providing robust protection for electronic components. This has led manufacturers to offer novel encapsulant formulations with improved dielectric properties. Stringent regulations regarding minimization of electronic waste is also fueling the development of recyclable and non-toxic radio frequency transmitter encapsulant materials.

Porter’s Analysis

Threat of new entrants: Low. The Radio Frequency Transmitter Encapsulant market requires high initial investments and established distribution channels.

Bargaining power of buyers: Moderate. The presence of several manufacturers reduces the bargaining power of individual buyers. However, large buyers can negotiate discounts.

Bargaining power of suppliers: Low. The critical raw materials used in the market are commonly available. Suppliers have less influence on pricing.

Threat of new substitutes: Low. There are limited product substitutes for Radio Frequency Transmitter Encapsulant due to its specialized functionality.

Competitive rivalry: High. The market is fragmented with the presence of several global and regional players. Companies compete based on product quality, pricing, and innovation.

Key Takeaways

The global Radio Frequency Transmitter Encapsulant Market Size is expected to reach US$ 3.75 Bn by 2030, expanding at a CAGR of 5.5% over the forecast period. Increasing demand for wireless communication devices such as smartphones, tablets is expected to drive market growth.

Regionally, North America dominates the global market and is expected to continue its dominance over the forecast period. This can be attributed to the presence of established electronics manufacturers and major chip manufacturing companies in the region. The Asia Pacific region is expected to emerge as the fastest growing market, owing to rapid industrialization and growing demand for consumer electronics from developing countries such as India and China.

Key players operating in the Radio Frequency Transmitter Encapsulant market are Dow, Henkel, BASF, Nordson, LORD Corporation, H.B. Fuller, Siltech Corporation, Qualcomm, Broadcom, Skyworks Solutions, Qorvo. These players are focusing on new product development and mergers & acquisitions to gain a competitive edge in the market. For instance, in 2022, BASF unveiled its new liquid encapsulant BASF ULTRASEAL HT 1580 to address higher power and frequency chip reliability requirements in 5G applications.

*Note:
1.            Source: Coherent Market Insights, Public sources, Desk research
2.            We have leveraged AI tools to mine information and compile it