May 27, 2024

Copper Sputtering Target Market Driven By Increasing Demand Of Semiconductors Devices

Copper sputtering targets are extensively used for the deposition of copper thin films in the manufacturing of semiconductors and electronic devices. Copper provides high electrical conductivity and better adhesion properties compared to aluminum. The need for high-speed data transfer and miniaturization of electronic products is expected to drive the demand for copper sputtering targets in semiconductor manufacturing. Copper metallization has replaced aluminum in many IC applications owing to its lower resistivity. The increasing penetration of smartphones, tablets, and other consumer electronics has augmented the demand for ICs and semiconductors. This is anticipated to propel the growth of the global copper sputtering target market over the forecast period. The global copper sputtering target market is estimated to be valued at US$ 4.26 billion in 2024 and is expected to exhibit a CAGR of 22% over the forecast period 2024 to 2031, as highlighted in a new report published by Coherent Market Insights.

Market key trends:
One of the key trends in the copper sputtering target market is the rising adoption of Radio-frequency (RF) sputtering targets. RF sputtering allows for more uniform deposition and is commonly used for insulating targets like oxides. RF sputtering is preferable over direct current sputtering for dielectric targets as it prevents charge build up during the sputtering process, which can create non-uniform deposition. Leading players are focusing on developing new RF sputtering target materials to expand their product offerings. For instance, Materion Corporation offers RF sputtering targets made of copper oxide and doped copper oxide materials for applications such as RTD sensors and resistors requiring precise thickness control. The increasing demand for miniaturized semiconductors and electronics is projected to boost the adoption of RF sputtering technology, thereby driving the copper sputtering target market.

Porter’s Analysis
Threat of new entrants: The copper sputtering target market requires large investments for production and expansion, limiting new players. However, technologically advanced new entrants may gain market share.

Bargaining power of buyers: Buyers have moderate bargaining power due to the presence of many established target manufacturers. Buyers can negotiate on price and demand customization.

Bargaining power of suppliers: Suppliers have low to moderate bargaining power as copper can be substituted and is recyclable. Suppliers depend on a handful of large target manufacturers.

Threat of new substitutes: Alternatives like aluminum targets pose low threat as copper targets are most suitable for specific industrial applications that demand high conductivity.

Competitive rivalry: The market has a few global players with others being regionally strong.Players differentiate through innovation, quality, and cost competiveness to gain market share.

Key Takeaways
The Global Copper Sputtering Target Market Growth is expected to witness high. The growth can be attributed to expanding electronics and solar industries that increasingly use copper targets for manufacturing processes like thin film deposition.

Asia Pacific is expected to dominate the copper sputtering target market during the forecast period. This is due to the rising demand from electronics manufacturers, especially in China, South Korea, and Taiwan. Additionally, the region is a major manufacturing base for solar photovoltaic cells.

Key players operating in the Copper Sputtering Target are YINYAN Model Tech MFT., Tian Yu Hi-tech Co. Ltd, Eachine, Hubsan. These players are focusing on new product development and expanding their manufacturing facilities to meet the growing demand.

*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it